heat sink structure for electric and electronic products

摘要

In the case of fixing the heat radiating fin to the coupling groove of the heat sink to which the semiconductor element is attached to the front side, and fixing it by pressing by pressing, the protrusion of the radiating fin is pushed in one direction in the coupling groove when pressed by the press, thereby reducing the occurrence of gaps. To guide the pressurized position by the press by the uneven portion formed in the pressing portion of the coupling groove to improve the workability and productivity,;The heat sink coupling structure for electric and electronic products according to the present invention includes a heat sink in which a semiconductor device is closely fixed to a rear surface thereof, and a coupling groove is formed at a constant interval on the front surface thereof;;Protruding portion formed to correspond to the coupling groove is formed integrally at the bottom, and has a heat radiation fin for radiating heat generated from the semiconductor element due to air circulation,;After the protrusion of the heat sink fin is coupled to the coupling groove of the heat sink, the pressing portion of the upper end of the coupling groove is pressed by pressing the pressing portion in the opposite direction of the pressing portion in the coupling groove when pressed by the press.