On the Heat Transfer Enhancement Based on Micro-Scale Air Impinging Jets with Microstructure Heat Sink in Electronics Cooling

摘要

A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface.