Electronic circuit structure manufacturing method for heat sink, involves directly designing electrically insulating layer and electrically conductive layer on heat sink by thermal spraying method or cold gas-spraying method

摘要

The method involves directly designing a specifically structured, electrically insulating layer (2) and a specifically structured, electrically conductive layer (3) on a heat sink (1) by thermal spraying method or a cold gas-spraying method. The electrically insulating layer is designed as a ceramic layer and the electrically conductive layer is designed as a copper layer. The layers are structured by a mask. An independent claim is also included for an electronic circuit structure on a heat sink.