Dryer of substrates, e.g. semiconductor wafers, after treatment in appropriate liquid, with substrates lifted from treatment liquid and fluid reducing surface tension of treatment liquid

摘要

Substrate dryer after wet treatment has equipment for lifting substrate, e.g. semiconductor wafer, from treatment liquid. It contains two opposite, mutually facing feeders for fluid, reducing surface tension of treatment liquid, directed against liquid. Feeders are so spaced apart that wafers can be moved between them. Feed control unit of fluid control alternative supply of fluid to opposite feeders. Preferably each feeder is fitted with supply line coupled to common fluid source. Independent claims are included for drying method of substrates after wet treatment.