Device for treating surface of disk-shaped substrate by application and hydro-extracting of treatment liquid and for wet-chemical treatment of wafer during semiconductor manufacturing, has substrate carrier turned around carrier surface

摘要

The device has a substrate carrier (20) that is turned around a carrier surface (22), where a radial outward slopping is provided in the carrier surface. An outside diameter of the carrier is equal to a substrate (10). The carrier surface has a diameter with the step width of 50 millimeter.