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Bonding components of materials with different melting points, e.g. contacts for automotive sensors and actuators, involves melting a projection with lower melting point at least partially within a recess in the other component
Bonding components of materials with different melting points, e.g. contacts for automotive sensors and actuators, involves melting a projection with lower melting point at least partially within a recess in the other component
To bond together components (10,15) of different materials with different melting points, e.g. temperature resistant automotive sensor and actuator contacts, the component with the higher melting point has a recess (11) to accommodate a projection (16) at the other component with a lower melting point and which also acts as a limit stop. The second component is heated above its melting point, at least partially at the projection, especially by a laser diode. The projection melts at least partially to fill the recess and form a bond between them in a positive fit. A gap (18) is left between the projection and the recess, wholly covered by the upper side (19) of the second component.
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