首页> 外国专利> Bonding components of materials with different melting points, e.g. contacts for automotive sensors and actuators, involves melting a projection with lower melting point at least partially within a recess in the other component

Bonding components of materials with different melting points, e.g. contacts for automotive sensors and actuators, involves melting a projection with lower melting point at least partially within a recess in the other component

机译:具有不同熔点的材料的粘合成分,例如用于汽车传感器和执行器的触点,涉及将熔点较低的凸起至少部分地熔化在其他组件的凹槽中

摘要

To bond together components (10,15) of different materials with different melting points, e.g. temperature resistant automotive sensor and actuator contacts, the component with the higher melting point has a recess (11) to accommodate a projection (16) at the other component with a lower melting point and which also acts as a limit stop. The second component is heated above its melting point, at least partially at the projection, especially by a laser diode. The projection melts at least partially to fill the recess and form a bond between them in a positive fit. A gap (18) is left between the projection and the recess, wholly covered by the upper side (19) of the second component.
机译:将具有不同熔点(例如熔点)的不同材料的组分(10,15)粘合在一起耐高温汽车传感器和执行器触点,熔点较高的部件具有凹槽(11),以便在熔点较低的其他部件上容纳凸起(16),该凸起也用作限位挡块。尤其是通过激光二极管,将第二组分至少部分地在凸起处加热到其熔点以上。突出部至少部分熔化以填充凹部,并在它们之间形成形状配合。在凸起和凹部之间留有间隙(18),该间隙被第二部件的上侧(19)完全覆盖。

著录项

  • 公开/公告号DE10359564A1

    专利类型

  • 公开/公告日2005-07-28

    原文格式PDF

  • 申请/专利权人 ROBERT BOSCH GMBH;

    申请/专利号DE2003159564

  • 发明设计人 HOHENBERGER BERND;RAMSAYER REINER;

    申请日2003-12-18

  • 分类号B23K33/00;

  • 国家 DE

  • 入库时间 2022-08-21 22:01:00

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