Drying apparatus for e.g. semiconductor wafer, has vent unit that controls flow of drying material to uniformly or substantially uniformly dry semiconductor wafer in drying chamber

摘要

A vent unit (5) controls the flow of drying material to uniformly or substantially uniformly dry a semiconductor wafer in a drying chamber (1,3). Independent claims are also included for the following: (A) a vent unit; and (B) a wafer drying method.