Modular cooling arrangement for a graphics card, has a superstructure design with a cooling attachment mounted on a heat transfer plate, which has arm extensions for cooling adjoining RAM chips

摘要

Modular cooling arrangement with a superstructure design for cooling semiconductor chips on graphics cards. The modular arrangement comprises a cooling attachment (8) attached in a heat conducting manner to a heat conducting plate (5). The latter has extending arms (6) that form a tight form-fit with RAM chips adjoining a graphics processor unit which is cooled by the main part of the heat conducting plate and the cooling attachment.