Liquid-cooled modular cooling arrangement for a graphics card, has a substructure, modular design with a heat conducting plate in thermal contact with a base plate and having heat conducting arms for cooling adjoining RAM chips

摘要

Modular cooling arrangement with a substructure design for cooling semiconductor chips on a graphics card has a modular cooling arrangement (1) comprising a heat conducting plate (5) and cooling base element, whereby the plate is attached to the base in a heat conducting manner and arms (6) of the heat conducting plate form a tight form-fit with adjoining RAM components.