Correction of erroneous patterns realised in thin layers by direct engraving, during the fabrication of integrated circuits and micro electronic mechanical systems

摘要

The correction of an erroneous design realised in a first thin layer comprising a first engraved sub-layer (120) with the erroneous design and at least one second sub-layer (110) situated between a substrate (100) and the first sub-layer, consists of: (A) deposition of a second thin layer (300) on the first thin layer; (B) the direct engraving in the second thin layer of the desired correction; (C) engraving the second sub-layer across the first sub-layer.