首页> 外国专利> Fabrication of electronic components using a noble support for front end fabrication and a less costly support, with specific desired physical properties, for back end fabrication

Fabrication of electronic components using a noble support for front end fabrication and a less costly support, with specific desired physical properties, for back end fabrication

机译:使用贵金属支撑件进行前端制造,以及使用成本较低的支撑件(具有特定的所需物理特性)进行后端制造,从而制造电子部件

摘要

Fabrication of electronic components comprises: (a) selecting a noble support substrate of which the physical and chemical properties are appropriate for the fabrication of the electronic components; (b) effecting, at the level of an active layer (3) supported by the substrate and/or constituting a part of it, all the stages, non-contaminating or non-destructive for the substrate, of formation of semi-finished electronic components (6); (c) transferring the active layer supporting the semi-finished electronic components on to a reception substrate (8) or onto a stiffener (7) for effecting the polluting finishing stages of the electronic components.
机译:电子部件的制造包括:(a)选择其物理和化学性质适合于电子部件制造的贵金属支撑衬底; (b)在由基板支撑和/或构成其一部分的有源层(3)的水平上,对基板进行无污染或无损的所有阶段的半成品电子形成组件(6); (c)将支撑半成品电子部件的有源层转移到接收基板(8)上或加强件(7)上,以实现电子部件的污染整理阶段。

著录项

  • 公开/公告号FR2866982A1

    专利类型

  • 公开/公告日2005-09-02

    原文格式PDF

  • 申请/专利权人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;

    申请/专利号FR20040001989

  • 发明设计人 GHYSELEN BRUNO;

    申请日2004-02-27

  • 分类号H01L21/18;

  • 国家 FR

  • 入库时间 2022-08-21 21:58:13

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