首页> 外国专利> HYDROGEN ION IMPLANT DOSE MEASURING METHOD OF SILICON SEMICONDUCTOR SUBSTRATE, AND SUBSTRATE FOR STANDARD SAMPLE

HYDROGEN ION IMPLANT DOSE MEASURING METHOD OF SILICON SEMICONDUCTOR SUBSTRATE, AND SUBSTRATE FOR STANDARD SAMPLE

机译:硅基质中氢离子注入剂量的测定方法及标准样品中的基质

摘要

PROBLEM TO BE SOLVED: To solve the problem that, regarding a measurement of a hydrogen ion implant dose of a silicon semiconductor substrate, the monitor method of the ion implant dose using a regular Faraday cup is established assuming that all ions to irradiate have charges, and when irradiated in a state of electrically nuetral elements having no charges due to an abnormality (e.g., a reduction of a vacuum level or an abnormal discharge) during an ion irradiation process, it is impossible to measure by the Faraday cup method, and elements over ones monitored are implanted into the semiconductor substrate.;SOLUTION: By use of an FT-IR device from IR waveforms prior to hydrogen ions implanted into the semiconductor substrate, the IR waveform of an FZ crystal semiconductor substrate is acquired by a difference spectrum method (an FZ crystal corrected IR waveform prior to implantation of the hydrogen ions). Next, from the IR waveforms after the hydrogen ions are implanted, the IR waveform of the FZ crystal semiconductor substrate is acquired by the difference spectrum method, and a difference is acquired between this IR waveform and the FZ crystal corrected IR waveform prior to implantation of the hydrogen ions, as acquired above, thereby accurately measuring the hydrogen implant dose implanted into the semiconductor substrate.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:要解决的问题:为了解决关于测量硅半导体衬底的氢离子注入剂量的问题,假设所有要辐照的离子都带有电荷,建立了使用常规法拉第杯的离子注入剂量监测方法,当在离子辐照过程中由于异常(例如,真空度降低或异常放电)而在没有电荷的电中性元素的状态下进行辐照时,无法通过法拉第杯法进行测量,解决方案:通过使用FT-IR器件从氢离子注入到半导体衬底之前,先从IR波形获取红外波形,然后通过差谱法获得FZ晶体半导体衬底的IR波形(在注入氢离子之前经过FZ晶体校正的IR波形)。接下来,从氢离子注入后的IR波形中,通过差谱法获取FZ晶体半导体基板的IR波形,并在注入之前将其与经FZ晶体校正后的IR波形进行差分。氢离子,如上所获得,从而精确地测量注入到半导体衬底中的氢注入剂量。;版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006120901A

    专利类型

  • 公开/公告日2006-05-11

    原文格式PDF

  • 申请/专利权人 SUMCO CORP;

    申请/专利号JP20040307908

  • 申请日2004-10-22

  • 分类号H01L21/265;H01J37/317;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 21:56:19

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