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TIN-COATED COPPER POWDER AND COMPOSITE ELECTRICALLY CONDUCTIVE PASTE USING THE TIN-COATED COPPER POWDER

机译:锡涂层铜粉和使用锡涂层铜粉的复合导电浆料

摘要

PROBLEM TO BE SOLVED: To provide tin-coated copper powder particularly as composite electrically conductive metal power for a substitute for lead-free solder composed of fine particles with the particle diameter of ≤5 μm, having excellent dispersibility and capable of low temperature sintering, and which can form an electrically conductive part.;SOLUTION: The tin-coated copper powder is constituted so that the particles of copper powder are used as a core material, and the surface of each particle is provided with a tin-coated layer, wherein the particles of copper powder in which the value of the average particle diameter is 0.1 to 5 μm are used as the core material, and the surface of each particle of the copper powder is provided with a tin-coated layer of 40 to 70 wt.%.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供涂锡的铜粉,特别是作为复合导电金属粉,以代替无铅焊料,该无铅焊料由粒径为5 µm的细颗粒组成,具有优异的分散性并且能够降低解决方案:镀锡铜粉的构成应使铜粉颗粒用作芯材,并且每个颗粒的表面均具有镀锡涂层。层,其中将平均粒径为0.1至5μm的铜粉颗粒用作芯材,并且该铜粉的每个颗粒的表面均具有镀锡层。 40至70 wt。%.;版权:(C)2006,JPO&NCIPI

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