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UNBALANCED MAGNETRON SPUTTERING SYSTEM AND METHOD

机译:非平衡磁控溅射系统和方法

摘要

PROBLEM TO BE SOLVED: To deposit a film of uniform film quality over the whole region a substrate face while maintaining the characteristics of high adhesion in an unbalanced magnetron sputtering (UBMS) process.;SOLUTION: In the unbalanced magnetron sputtering (UBMS) system equipped with: an unbalanced magnetron sputtering electrode of forming a nonequilibrium magnetic field distribution; a rotary stage 1 provided with a holder 3 of holding a substrate 2; and a plurality of, preferably, three or more targets 4a, 4b, 4c provided around the rotary stage 1 and confronted with the surface of the substrate 2, (1) the plurality of, preferably, three or more targets 4a, 4b, 4c are installed in such a manner that their heights are changed, and also, a mechanism of rotating the stage 1 mounted with the substrate 2 is comprised, or (2) a mechanism of vibrating the substrate 2 to a parallel direction 5 to targets 4d, 4e, 4f (upper and lower directions to the rotary stage), and a mechanism of revolving the stage 1 mounted with the substrate 2 are comprised.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:在不平衡磁控溅射(UBMS)工艺中,在衬底表面的整个区域上沉积均匀质量的薄膜,同时保持高附着力的特性。解决方案:配备了不平衡磁控溅射(UBMS)系统具有不平衡的磁控溅射电极,形成不平衡的磁场分布;旋转台1,其具有保持基板2的保持器3。围绕旋转台1设置并与基板2的表面相对的多个,优选三个以上的靶4a,4b,4c,(1)多个,优选三个以上的多个靶4a,4b,4c以改变它们的高度的方式安装它们,并且,包括使安装有基板2的载物台1旋转的机构,或者(2)使基板2沿平行方向5振动到靶4d的机构,包括图4e,4f(相对于旋转台的上下方向)以及使安装有基板2的台1旋转的机构。版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2006077280A

    专利类型

  • 公开/公告日2006-03-23

    原文格式PDF

  • 申请/专利权人 TOYOTA MOTOR CORP;

    申请/专利号JP20040260984

  • 发明设计人 NAKAGAWA IKURO;

    申请日2004-09-08

  • 分类号C23C14/34;C23C14/50;G11B5/84;G11B5/851;

  • 国家 JP

  • 入库时间 2022-08-21 21:54:47

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