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UNBALANCED MAGNETRON SPUTTERING SYSTEM AND METHOD
UNBALANCED MAGNETRON SPUTTERING SYSTEM AND METHOD
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机译:非平衡磁控溅射系统和方法
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摘要
PROBLEM TO BE SOLVED: To deposit a film of uniform film quality over the whole region a substrate face while maintaining the characteristics of high adhesion in an unbalanced magnetron sputtering (UBMS) process.;SOLUTION: In the unbalanced magnetron sputtering (UBMS) system equipped with: an unbalanced magnetron sputtering electrode of forming a nonequilibrium magnetic field distribution; a rotary stage 1 provided with a holder 3 of holding a substrate 2; and a plurality of, preferably, three or more targets 4a, 4b, 4c provided around the rotary stage 1 and confronted with the surface of the substrate 2, (1) the plurality of, preferably, three or more targets 4a, 4b, 4c are installed in such a manner that their heights are changed, and also, a mechanism of rotating the stage 1 mounted with the substrate 2 is comprised, or (2) a mechanism of vibrating the substrate 2 to a parallel direction 5 to targets 4d, 4e, 4f (upper and lower directions to the rotary stage), and a mechanism of revolving the stage 1 mounted with the substrate 2 are comprised.;COPYRIGHT: (C)2006,JPO&NCIPI
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