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CUTOFF PIECE RECOVERY APPARATUS BY LASER BEAM MACHINING

机译:激光束加工切割件回收装置

摘要

PROBLEM TO BE SOLVED: To provide a cutoff piece recovery apparatus by laser beam machining, which recovers a cutoff piece produced when a flexible machining subject is machined by a laser beam, and which needs no new recovery apparatus, and enables economically an improvement in a recovery efficiency of punched pieces such as paper.;SOLUTION: A recovery body 24 is partitioned into an air pass area 26 and a recovery area 29 (30) by a filter part 25, the recovery area being divided into a first recovery area 29 and a second recovery area 30 or integrated by a first movable partitioning part 28 which is a first partitioning means. When the cutoff piece is introduced, the first movable partitioning part 28 partitions the recovery area, and when the recovery to the second recovery area 30 is carried out, the first movable partitioning part 28 forms an integral recovery area.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种通过激光束加工的切割件回收装置,该切割件回收装置回收通过激光束加工柔性加工对象时产生的切割件,并且不需要新的回收装置,并且能够经济地改进切割件。解决方案:回收体24被过滤器部件25划分为通气区26和回收区29(30),该回收区分为第一回收区29和回收区24。第二回收区域30或由作为第一分隔装置的第一可移动分隔部分28集成。当引入切断件时,第一可动分隔部分28分隔回收区域,并且当执行到第二回收区域30的复原时,第一可动分隔部分28形成整体的回收区域。 2006年,日本特许厅

著录项

  • 公开/公告号JP2006110444A

    专利类型

  • 公开/公告日2006-04-27

    原文格式PDF

  • 申请/专利权人 TOPPAN FORMS CO LTD;

    申请/专利号JP20040299638

  • 发明设计人 HIROHATA WATARU;

    申请日2004-10-14

  • 分类号B08B5/00;B01D46/42;

  • 国家 JP

  • 入库时间 2022-08-21 21:52:17

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