Multichip and multichip package, semiconductor equipment and electronic equipment

摘要

PROBLEM TO BE SOLVED: To enable easy three dimentional mounting of a semiconductor chip, while minimizing degradation in electrical characteristics. SOLUTION: Semiconductor chips, comprising common electrodes which are arrayed in the same array pattern, are laminated on the electrode terminal row of lower-layer chip with the edge of upper-layer chip aligned, and a conductive metal layer extending toward a chip backside, while conductive to the upper-layer electrode terminal is provided at the edge of the upper-layer chip, with the conductive metal layer and lower-layer electrode terminal are aligned to each other for continuity, using a metal mass before lamination.