The 1st lead/read

摘要

PROBLEM TO BE SOLVED: To provide a compact semiconductor laser device preventing it leads from coming off when soldering to an external circuit.;SOLUTION: This semiconductor laser device has a first lead section 7 having a mounting section for mounting a semiconductor laser chip 3, a second lead section 8 for an electrode, and a resin section 2 for fixing the first and second lead sections 7 and 8. An engagement section 9 for engaging to the resin section 2 is provided in a longitudinal direction at the second lead section 8, and at the same time the second lead section 8 is extended straight into the resin section 2.;COPYRIGHT: (C)2002,JPO