The supporter who possesses with the 1st supporter who opposes with the lead/read frame

摘要

PROBLEM TO BE SOLVED: To provide a lead frame capable of manufacturing a number of circuit devices efficiently, and to provide a manufacturing method of the circuit device using the lead frame.;SOLUTION: In the lead frame 10, a unit 26 is disposed, and the unit 26 is mechanically supported by a first support 14 and a second support 16 provided in a frame shape at the periphery. Furthermore, a half groove 22 is formed at the corresponding first support on an extension line of a parting line 20 prescribed at the boundary of the units 26, and a through groove 24 partially penetrating the corresponding second support on an extension line of a parting line 18 is formed.;COPYRIGHT: (C)2009,JPO&INPIT