Production method of gluing seat, dicing tape one somatotype gluing seat, and semiconductor device

摘要

This invention in low temperature below the 100C is sticking possible in the wafer, you handle at room temperature and it is soft possibly, at the same time, simultaneously with the wafer laminating the gluing seat, the said gluing seat and the dicing tape which are cutting possible in the cutting condition usually for being done, in order to offer the production method of the dicing tape one somatotype gluing seat which becomes, and the semiconductor device which uses these, break strength of the gluing seat, it is something which features that the breaking elongation and modulus of elasticity are stipulated in the numerical range of the respective specification.