首页>
外国专利>
The anode chamber which is used for plating, the plated manner which uses that and the anode plate which
The anode chamber which is used for plating, the plated manner which uses that and the anode plate which
展开▼
机译:用于电镀的阳极室,使用该阳极室的电镀方式以及用于电镀的阳极板
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide an anode chamber which is capable of executing plating at a high speed with a high current density by replenishing the inside of a plating liquid with a large amt. of the plating metal ions to be consumed by using a simple apparatus in the case electroplating is continuously executed by using an insoluble anode, a plating method using the same and a plating apparatus. ;SOLUTION: A plating cell 9 is internally provided with the anode chamber 1 which has the insoluble anode plate 2 and a diaphragm 3 allowing the free passage of the whole or part of the ions dissolved in the plating liquid and hardly allowing the passage of the plating liquid and has plural cells 5 partitioned by plural baffle plates 4 between the anode plate 2 and the diaphragm 3 and in which the plural cells 5 allow the free passage of the plating liquid within the respective cells 5 by the apertures disposed at the plural baffle plates 4. The plating liquid is supplied separately from the bulk plating liquid to the anode chamber 1 and an electrolysis is effected. The plating liquid of the anode chamber 1, where the ions of the plating metal are consumed and the pH thereof is lowered, is introduced into a dissolution vessel, where the plating metal is dissolved in the plating liquid improved in solubility by the lowering of the pH. The plating liquid is thus rapidly replenished with a large amt. of the plating metal ions.;COPYRIGHT: (C)1999,JPO
展开▼