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Pb-free solder alloy compositions comprising essentially tin(Sn), Silver(Ag), copper(Cu), and phosphorus(P)

机译:无铅焊料合金成分,主要包括锡(Sn),银(Ag),铜(Cu)和磷(P)

摘要

A Pb-free solder alloy based on Sn as matrix is provided, which is a metal that has no toxicity and is environmental friendly. The Pb-free solder comprises a tetra-nary composition consisting essentially of about 99.0 weight % Sn, 0.3 to 0.4 weight % Ag, and 0.6 to 0.7 weight % Cu, with off-eutectic melting temperature of 217 to 227 degree Celsius. The fourth component is a non-metallic phosphorus (P), and 0.01 to 1.0 weight % of phosphorus is added into said composition to improve better micro-structural stability and hence reduce the formation of dross when hand soldering, wave soldering and reflow soldering during the electronic assembly installation process.
机译:提供了一种以锡为基质的无铅焊料合金,该合金是无毒且环保的金属。无铅焊料包含基本上由约99.0重量%的Sn,0.3到0.4重量%的Ag和0.6到0.7重量%的Cu组成的四元组成,其非共熔熔点为217到227摄氏度。第四组分是非金属磷(P),并且将0.01至1.0重量%的磷添加到所述组合物中以改善更好的微观结构稳定性,并因此减少了在手工焊接,波峰焊接和回流焊接过程中产生的渣s。电子装配安装过程。

著录项

  • 公开/公告号US2006222559A1

    专利类型

  • 公开/公告日2006-10-05

    原文格式PDF

  • 申请/专利权人 WAI YIN DAVID LEUNG;

    申请/专利号US20060362310

  • 发明设计人 WAI YIN DAVID LEUNG;

    申请日2006-02-23

  • 分类号C22C13/00;

  • 国家 US

  • 入库时间 2022-08-21 21:45:11

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