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Evaluation of Soldering and Reliability Performance of NiPdAu Finished PPF with Pb-Free Solder Alloy 95.5Sn4.0Ag0.5Cu

机译：无铅焊锡合金95.5Sn4.0Ag0.5Cu对NiPdAu成品PPF的焊接和可靠性性能的评估

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1442-1448|共7页
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Zhao X.J.; Caers J.F.J.M.;
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4. Evaluation of Soldering and Reliability Performance of NiPdAu Finished PPF with Pb-Free Solder Alloy 95.5Sn4.0Ag0.5Cu [C] . Zhao X.J., Caers J.F.J.M. Electronic Components and Technology Conference . 2006

机译：NIPDAU的焊接和可靠性性能评价PPF与无铅焊接合金95.5SN4.0AG0.5CU
5. Synthesis, Formulation, and Reliability Study of Novel Pb-Free Nanocomposite Solder Pastes for Electronics Assembly and Packaging [D] . Wernicki, Evan . 2020

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6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

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8. Wave soldering with Pb-free solders [R] . Artaki, I. , Finley, D. W. , Jackson, A. M. , 1995

机译：使用无铅焊料进行波峰焊

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