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Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
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机译:用于形成厚膜的负性光致抗蚀剂组合物,光致抗蚀剂膜以及使用其的凸点形成方法
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摘要
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 μm thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
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