首页> 外国专利> Apparatus and measurement procedure for the fast, quantitative, non-contact topographic investigation of semiconductor wafers and other mirror like surfaces

Apparatus and measurement procedure for the fast, quantitative, non-contact topographic investigation of semiconductor wafers and other mirror like surfaces

机译:用于快速,定量,非接触式地研究半导体晶片和其他类似镜面的表面的设备和测量程序

摘要

Apparatus and process for fast, quantitative, non-contact topographic investigation of samples. Apparatus includes a light source, and a collimating concave mirror structured and arranged to produce a parallel beam and to direct the parallel beam to a sample to be investigated. A structured mask is located between the light source and the concave mirror, and an image sensor structured and arranged to receive a beam reflected from the sample and the concave mirror. Relative positions of the mask and the sensor to other elements of the apparatus are chosen to provide an essentially sharp image of the mask on the sensor. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.
机译:用于快速,定量,非接触式地貌调查的设备和过程。该设备包括光源,以及准直凹面镜,该准直凹面镜的结构和布置为产生平行光束并将平行光束指向要研究的样品。结构化的掩模位于光源和凹面镜之间,并且图像传感器构造和布置成接收从样品和凹面镜反射的光束。选择掩模和传感器相对于设备的其他元件的相对位置,以在传感器上提供掩模的基本清晰的图像。本摘要既无意于定义本说明书中公开的发明,也无意以任何方式限制本发明的范围。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号