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Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process
Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process
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机译:在化学机械平面化过程中减少或消除半导体晶片薄膜层脱层的方法
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摘要
A method for preventing de-lamination of semiconductor wafer film stacks during a linear belt-type chemical mechanical planarization (CMP) process is provided. The method implements a pulsed polishing head rotation during a CMP process to maintain a slurry distribution across the width of a belt pad. The slurry distribution is maintained in a manner that prevents de-lamination of a wafer film having weak adhesion characteristics. Thus, the pulsed polishing head rotation implemented by the method reduces de-lamination of low-K material film layers during the CMP process.
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