A process for chemically - mechanical planarization of barrier layer of semiconductor wafers

• 1. 一种用于阻挡层平坦化的化学机械抛光液及其使用方法 [P] . 中国专利： CN104745088B . 2019.02.15
• 2. 一种用于阻挡层平坦化的化学机械抛光液及其使用方法 [P] . 中国专利： CN104745088A . 2015-07-01
• 3. Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process [P] . 美国专利： US7040952B1 . 2006-05-09

  机译： 在化学机械平面化过程中减少或消除半导体晶片薄膜层脱层的方法

• 4. METHOD FOR CHEMICAL MECHANICAL PLANARIZING AN INTERLAYER INSULATING FILM OF SEMICONDUCTOR DEVICE USING CHEMICALLY-MECHANICALLY POLISHING PROCESS [P] . 韩国专利： KR20000004204A . 2000-01-25

  机译： 化学机械抛光工艺的化学机械平面化层间绝缘膜的方法

• 5. Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers [P] . 美国专利： USRE39413E . 2006-11-28

  机译： 低摩擦抛光停止层，用于终结半导体晶圆的化学机械平面化处理

• 1. Mechanical Characteristics of Chemically Degraded Surface Layers of Wood [J] . Jiri Frankl, Michal Kloiber, Milos Dradacky, 机械工程与自动化：英文版 . 2012,第011期
• 2. Studies on Copper Damascene Barrier Slurries: Semiconductor Dissolution in Chemical Mechanical Planarization Process [C] . Y. Sheldon Mao, David Merricks, Bob Her Twentieth International Vlsi Multilevel Interconnection Conference (VMIC); Sep 23-25, 2003; Marina del Rey, California . 2003
• 3. Slurry mean residence time analysis and pad-wafer contact characterization in chemical mechanical planarization. [D] . Mu, Yan. 2016
• 4. Flexible metal-semiconductor-metal device prototype on wafer-scale thick boron nitride layers grown by MOVPE [O] . Xin Li, Matthew B. Jordan, Taha Ayari, -1
• 5. On the Wafer/Pad Friction of Chemical–Mechanical Planarization (CMP) Processes—Part I: Modeling and Analysis [O] . J. Yi 2005

• 1. Schottky Barriers on Layered Anisotropic Semiconductor – WSesub2/sub– with 1000 #197;Indium Metal Thickness [J] . Achamma John Mathai ,Chalappally Kesav Sumesh ,Bharat Purushotamds Modi . 材料科学与应用期刊（英文） . 2011,第8期
• 2. A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera [J] . Michel Saydé ,Ahmed Lakhssassi ,Emmanuel Kengne . 生物科学与医学（英文） . 2013,第2期
• 3. The organic diamond disk(ODD)for dressing polishing pads of chemical mechanical planarization [J] . Chou Cheng-Shiang ,Sung James C. ,Pai Yang-Liang . 金刚石与磨料磨具工程 . 2008,第S1期
• 4. TWO STEPS CHEMICAL-MECHANICAL POLISHING OF RIGID DISK SUBSTRATE TO GET ATOM-SCALE PLANARIZATION SURFACE [J] . LEI Hong ,LUO Jianbin ,LU Xinchun . 中国机械工程学报 . 2006,第004期
• 5. 基于电化学的化学机械平坦化终点检测方法及实验研究 [C] . 王同庆 . 第十二届设计与制造前沿国际会议（ICFDM2016） . 2016
• 6. 低机械压力的铜布线化学机械平坦化研究 [A] . 武鹏 . 2016