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The manufacturing process of an antenna of the chip card hu00ecbrido contact without contact or no contact and its chip card hu00ecbrido contact without contact or no contact

机译:芯片卡无接触或无接触天线的制造过程及其芯片卡无接触或无接触的天线的制造过程

摘要

"The manufacturing process of an antenna chip card hu00ecbrido contact without contact or no contact and its chip card hu00ecbrido contact without contact or no contact.The manufacturing process of an antenna of the chip card without contact or hybrid contact contactless which comprises a support 10, 11 on which is carried on the antenna, two bodies and card 32, 42, 34.44 on each side of the support, each of the bodies of the card consisting of at least one layer of thermoplastic, and a chip 30 or by a module connected to the antenna.This process comprises the following steps: a step of placing a layer of a material composed mainly of resin on a predetermined area 12, 13 of the antenna bracket.- a stage of manufacture of the antenna which consists of serigrafar coils 14, 15, and two contacts 16, 18, 17,19 connecting conductive polymer ink on the area previously carried out on the support and the support is subjected to a heat treatment in order to cook the ink.
机译:“天线触点不接触或不接触的芯片卡的制造过程及其天线芯片触点不接触或不接触的制造工艺天线触点不混合或混合接触的芯片卡的天线制造过程它包括一个支撑在天线上的支架10、11,两个主体以及在该支架的每一侧的卡32、42、34.44,该卡的每个主体都由至少一层热塑性塑料组成,并且芯片30或连接到天线的模块。此过程包括以下步骤:在天线支架的预定区域12、13上放置一层主要由树脂组成的材料层。-天线的制造阶段它由串联线圈14、15和两个触点16、18、17、19组成,触点16、18、17、19将导电聚合物油墨连接到先前在支撑体上进行的区域上,并且对该支撑体进行热处理以烹饪油墨。

著录项

  • 公开/公告号BRPI0408701A

    专利类型

  • 公开/公告日2006-03-07

    原文格式PDF

  • 申请/专利权人 ASK S.A.;

    申请/专利号BR2004PI08701

  • 发明设计人 PIERRE BENATO;

    申请日2004-03-26

  • 分类号G06K19/077;

  • 国家 BR

  • 入库时间 2022-08-21 21:40:10

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