Method of manufacture of a chip card without contact and a chip card without contact

摘要

The plastic substrate (1) has a recess (6). An antenna coil (5) is placed on an upper surface (4) of the substrate. An integrated circuit component (3) is located on the back surface (2), opposite the upper surface. The two (3, 5) are electrically-connected. The substrate is now introduced into an injection mold (9). The card body (8) is injected onto the back surface (2) of the substrate. The connection between coil and the terminals of the integrated circuit component, is made by metallic through-connections guided in recesses (6). The coil is covered and smoothed by a finishing layer (14) whilst impressing this upper surface (4) and/or the finishing layer. The chip card is manufactured in a continuous process. An independent claim is included for the corresponding chip card.