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Method of manufacture of a chip card without contact, or hybrid contact - without contact is strengthened
Method of manufacture of a chip card without contact, or hybrid contact - without contact is strengthened
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机译:无接触或混合接触的芯片卡制造方法-加强了无接触
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摘要
The chip card comprises an antenna support (40), which is coated by a process of lamination. Two sheets of thermoplastic material are fused to each side of the aerial support, prior to the attachment of further plastic layers (66,68) to either side of the structure by a hot pressing technique. The chip card comprises an antenna support (40), two cards and an electronic module including a chip (50) connected to an antenna. The process includes a first stage of lamination, in which two sheets of thermoplastic material are fused to each side of the aerial support, at a sufficiently high temperature for the material of the sheets to melt and flow over the surface to hide any differences in thickness of the antenna support. A second stage of lamination is carried out after a time in which the first stage lamination has set, and comprises the attachment of further plastic layers (66,68) to either side of the structure by a hot pressing technique. These plastic layers form the outer surfaces of the finished card.
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