首页> 外国专利> Method of manufacture of a chip card without contact, or hybrid contact - without contact is strengthened

Method of manufacture of a chip card without contact, or hybrid contact - without contact is strengthened

机译:无接触或混合接触的芯片卡制造方法-加强了无接触

摘要

The chip card comprises an antenna support (40), which is coated by a process of lamination. Two sheets of thermoplastic material are fused to each side of the aerial support, prior to the attachment of further plastic layers (66,68) to either side of the structure by a hot pressing technique. The chip card comprises an antenna support (40), two cards and an electronic module including a chip (50) connected to an antenna. The process includes a first stage of lamination, in which two sheets of thermoplastic material are fused to each side of the aerial support, at a sufficiently high temperature for the material of the sheets to melt and flow over the surface to hide any differences in thickness of the antenna support. A second stage of lamination is carried out after a time in which the first stage lamination has set, and comprises the attachment of further plastic layers (66,68) to either side of the structure by a hot pressing technique. These plastic layers form the outer surfaces of the finished card.
机译:该芯片卡包括天线支架(40),该天线支架通过层压过程被涂覆。在通过热压技术将其他塑料层(66,68)连接到结构的任何一侧之前,将两片热塑性材料熔合到高空作业支撑的每一侧。该芯片卡包括天线支架(40),两个卡和电子模块,该电子模块包括连接到天线的芯片(50)。该过程包括层压的第一阶段,其中在足够高的温度下将两片热塑性材料片融合到空中支撑的每一侧,以使片材料熔融并在表面上流动以掩盖厚度上的任何差异天线支架。在第一阶段的层压已经设定的时间之后,进行第二阶段的层压,并且包括通过热压技术将另外的塑料层(66,68)附接到结构的任一侧。这些塑料层形成成品卡的外表面。

著录项

  • 公开/公告号FR2844620B1

    专利类型

  • 公开/公告日2005-01-07

    原文格式PDF

  • 申请/专利权人 ASK;

    申请/专利号FR20030002258

  • 申请日2003-02-25

  • 分类号G06K19/07;

  • 国家 FR

  • 入库时间 2022-08-21 21:58:35

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