首页> 外国专利> The manufacturing process of a card with a contactless chip or a chip card with a contact without contact hu00ecbrido

The manufacturing process of a card with a contactless chip or a chip card with a contact without contact hu00ecbrido

机译:具有非接触式芯片的卡或具有无接触的芯片卡的制造过程

摘要

"The manufacturing process of a card with a contactless chip or a chip card with a contact hu00ecbrido without contact.The manufacturing process of a chip card comprising an antenna bracket, two bodies of the card and an electronic module or a chip connected to the antenna.This process comprises a first step of on the other hand lamination consisting of solder on each side of the antenna mast (10 or 40) two sheets of thermoplastic (32, 34 or 62.64) at a temperature sufficient for that matter that composes the leaves will soften and flow completely so as to do away with all the differences in the thickness of the antenna bracket.And a second stage of rolling carried out after a time corresponding to the time required for the thermoplastic sheets (32, 34, 62, 64) are solidified.The second stage consisting of solder on the sides and the plasticised flat antenna mast (30 or 60) of a uniform thickness laminated by two layers made of thermoplastic sheets MaTu00e9ria plastic (36, 38, 66, 68), which constitute the body of the card, by hot pressing.
机译:具有非接触式芯片的卡的制造过程或具有非接触式接触的芯片卡的制造过程。包括天线支架,卡的两个主体和电子模块或连接的芯片的芯片卡的制造过程另一方面,该过程包括第一步,该步骤包括在天线桅杆(10或40)的每一侧上层压焊料,在两层热塑性塑料(32、34或62.64)上,在足以满足该要求的温度下层压,组成的叶子将变软并完全流动,从而消除天线支架厚度上的所有差异。第二阶段的轧制在对应于热塑性片材所需时间之后进行(32、34, 62、64)固化。第二阶段包括侧面的焊料和均匀厚度的增塑的扁平天线杆(30或60),该厚度由两层由热塑性片MaT u00e9ria塑料制成的层(36、38、66, 6 8),通过热压构成卡片的主体。

著录项

  • 公开/公告号BR0306304A

    专利类型

  • 公开/公告日2004-09-28

    原文格式PDF

  • 申请/专利权人 ASK S.A.;

    申请/专利号BR20030306304

  • 申请日2003-09-12

  • 分类号G06K19/077;

  • 国家 BR

  • 入库时间 2022-08-21 23:11:53

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