Hardware for production test of RFID interface embedded into chips for smart cards and labels used in contactless applications

摘要

Application-oriented, production wafer test of the RFID interfaces embedded in VLSI devices such as contactless applications for smart cards and identification TAGs, falling in the frequency range below 20 MHz, require a specific testing solution. There must be external circuitry on the probe card with limits of the parallel test to 1 to 3 devices. A test solution embedded into standard ATE and capable of testing up to 32 dies in parallel, without any external circuits will be discussed in this paper.