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Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method

机译:芯片型固体电解电容器的制造方法和执行该方法的设备

摘要

An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.
机译:从电容器元件14的电容器主体18延伸的阳极引线17安装在阳极端子12的连接部21上,并且阳极引线17和连接部21通过激光B焊接在一起。执行焊接操作。在阳极引线17被推压到所述阳极引线和所述连接部分之间的区域中的连接部分21的状态下,通过激光B被激光B照射。可替代地,在具有阳极的引线容纳在连接部与电容器主体之间的区域中布置有具有缝隙并且用于反射反射的激光的功能的反射板的状态下,通过激光B执行焊接操作。 。

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