首页> 外国专利> SLURRY COMPOSITION USED FOR A CHEMICAL MECHANICAL POLISHING PROCESS, CHEMICAL MECHANICAL POLISHING METHOD USING THE SLURRY COMPOSITION AND METHOD OF FORMING A GATE PATTERN USING THE METHOD

SLURRY COMPOSITION USED FOR A CHEMICAL MECHANICAL POLISHING PROCESS, CHEMICAL MECHANICAL POLISHING METHOD USING THE SLURRY COMPOSITION AND METHOD OF FORMING A GATE PATTERN USING THE METHOD

机译:用于化学机械抛光过程的淤浆组合物,使用淤浆组合物的化学机械抛光方法以及使用该方法形成门图案的方法

摘要

A slurry composition includes about 4.25 to about 18.5 weight percent of an abrasive, about 80 to about 95 weight percent of deionized water, and about 0.05 to about 1.5 weight percent of an additive. The slurry composition may further include a surfactant. In a polishing method using the slurry composition, a polysilicon layer may be rapidly polished, and also dishing and erosion of the polysilicon layer may be suppressed.
机译:浆料组合物包含约4.25至约18.5重量%的磨料,约80至约95重量%的去离子水和约0.05至约1.5重量%的添加剂。浆料组合物可进一步包含表面活性剂。在使用浆料组合物的抛光方法中,可以快速抛光多晶硅层,并且还可以抑制多晶硅层的凹陷和腐蚀。

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