WAFER RECOVERY STATION AND APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE THEREBY

摘要

wafer recovery station apparatus for manufacturing a semiconductor device is provided. Wafer recovery station of the semiconductor device manufacturing apparatus is installed in an exposure process in which a rough wafer is loaded support , the cloth is formed so as to penetrate through the support study , vacuum line connected to the piercer to pass a predetermined vacuum pressure in drilling , the vacuum line a predetermined control signal in response to the pressure sensor , the pressure signal transmitted operation receives signals from the sensor passes a predetermined operation unit detects a change of pressure vacuum line for generating a predetermined operation signal according to whether the wafer is loaded on the support includes a controller for generating a . Further, there is provided a semiconductor device manufacturing apparatus using the same .