WAFER FLATZONE ALIGNER HAVING AN CLEANING PART

摘要

The present invention relates to a wafer flat zone aligning apparatus having a cleaning portion, comprising: a main body equipped with a roller in contact with the wafer arc portion, and a cleaning portion sprayed with a cleaning material under the roller to clean the surface of the roller, and then dried in the main body. It is provided to provide a wafer flat zone alignment device having a cleaning portion capable of preventing contamination of the wafer circumference by removing foreign substances generated on the roller before the wafer flat zone alignment.