METHOD FOR FORMING SOLDER BALL PAD IN BGA PRINTED CIRCUIT BOARD AND BGA PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM

摘要

The present invention relates to a method for forming a solder ball pad of a BGA printed circuit board and a BGA printed circuit board manufactured therefrom. The present invention provides electroless nickel / gold plating by imparting a certain range of roughness to a copper base layer of a solder ball pad. It is characterized by improving the bonding strength between ENIG and Electroless Nickel Immersion Gold (SIG) layers and solder layers.;BGA, Printed Circuit Board, Solder Ball Pad, Solder Bond Strength, ENIG, Electroless Nickel Plating, Gold Plating