Microelectronic device chip having a fine pitch bump structure having non-conductive sidewalls, a package thereof, a liquid crystal display device comprising the same, and a manufacturing method thereof

摘要

A semiconductor device employing the bump structure includes a plurality of bump structures arrayed along a substrate in a first direction. Each bump structure has a width in the first direction greater than a pitch gap between successively arrayed bump structures, and at least one bump structure has a sidewall facing in the first direction that is non-conductive.