MICROELECTRONIC ELEMENT CHIP CONTAINING HYBRID GOLD BUMP, ITS PACKAGE, LIQUID CRYSTAL DISPLAY DEVICE CONTAINING IT, AND MANUFACTURING METHOD OF SUCH MICROELECTRONIC ELEMENT CHIP

摘要

PPROBLEM TO BE SOLVED: To provide a liquid crystal display device containing a microelectronic element chip containing a hybrid gold bump where foreign matter is not generated in a probe chip at EDS test, a package containing such a microelectronic element chip and such a microelectronic element chip, and to further provide a method of manufacturing such a microelectronic element chip. PSOLUTION: The microelectronic element chip containing the hybrid gold bump where the foreign matter is not generated in the probe chip at EDS test is provided, and includes a chip pad in which the microelectronic element chip is connected to the microelectronic element formed on a substrate and an electric contact is formed between the microelectronic element and the outside of the chip, and a bump which is formed on the chip pad and is composed of a composite film of at least two layers or more. PCOPYRIGHT: (C)2006,JPO&NCIPI