Semiconductor device, e.g. liquid crystal display driver integrated circuit package, includes bump structures having width greater than pitch gap between successively arrayed bump structures, and having non-conductive sidewall

摘要

A semiconductor device comprises bump structures (100, 102) arrayed along a substrate (200) in a first direction, each bump structure having a width in the first direction greater than a pitch gap between successively arrayed bump structures, and at least one bump structure having a sidewall (106) facing in the first direction that is non-conductive. An independent claim is also included for a method of forming a semiconductor device, comprising forming bump structures arrayed along a substrate in a first direction.