A method for electroplating of copper by means of a structured dielectric layer, about the process - uniformity of a subsequent cmp - process to improve

摘要

A method for depositing a metal by means of a substrate with a dielectric layer, which is formed therein a structured field and a substantially not structured field, which method comprises:The effects of an electrolytic bath on the substrate, metal, from bottom to top in the structured field in the case of a conformal manner not to deposit;Forming a over weft metal layer over the structured region and the essentially not structured field;Controlling at least one process parameter during the formation of the over weft metal layer, in order to provide a surface roughness of the over weft metal layer; andRemoval of the over weft metal layer by chemically - mechanical polishing, wherein the increased surface roughness of the removal of the over weft metal layer promotes.