Active semiconductor arrangement with at least one module plane and having a raised geometry with a conductive layer to make contact with an upper plane

摘要

The active semiconductor arrangement has at least one module plane and comprises a substrate (5), on which active semiconductors are arranged. At least one further plane (3) is arranged spaced above the modular plane. An electrical connection is provided between the modular plane and the upper plane. The electrical connection (4) comprises a geometry (7) formed in the substrate and raised relative to the substrate surface (6). This raised geometry at least partly extends across the distance between the upper plane and the modular plane. The raised geometry is at least partly provided with an electrically conductive layer (8) to make an electrical contact with the upper plane.