Bracing technology in a contact plane of semiconductor devices by means of the two conductive layers and an insulating distance holder in the case of a semiconductor device

摘要

Semiconductor component with:a contact region of a circuit element, which is formed in a semiconductor region;a material layer stack, which is connected to a part of the contact region is formed, wherein the material layer stack has a first dielectric layer, an on the first dielectric layer strain inducing formed not - insulating material layer and a second dielectric layer, the above the deformation induzier ends not - insulating material layer is formed, wherein said strain inducing not - insulating material layer causes a deformation in the semiconductor region;a dielectric intermediate layer material, which extends over the contact region is formed;a contact element, which extends through the dielectric interlayer material and through an opening which extends in the material layer stack is formed, wherein the contact element establishes a connection to the contact region; anda spacer element, which is formed on side walls of the opening, so that the strain inducing not - insulating material layer is insulated laterally.