Bracing technology in a contact plane of semiconductor devices by means of the two conductive layers and an insulating distance holder

摘要

In complex semiconductor components are strain inducing materials with a reduced insulating strength or with a certain conductivity, for example, metal nitrides, and the like in the contact plane, are used in order to the performance of circuit elements of, for example of field effect transistors, to improve. For this purpose, a deformation induzier end material efficiently on the basis of a dielectric layer stack is enclosed, of the prior to the application of the actual dielectric between the layer material is structured, wherein the side wall surfaces areas on the basis of be masked spacer members.