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Semiconductor component has crack forming structure between substrate and passivation layer to promote cracks at defined positions under mechanical stress
Semiconductor component has crack forming structure between substrate and passivation layer to promote cracks at defined positions under mechanical stress
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机译:半导体组件在基板和钝化层之间具有裂纹形成结构,以在机械应力下促进指定位置的裂纹
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摘要
Semiconductor component comprises a passivation layer (6) over a semiconductor body (1) with a crack-forming structure (10,11) between them that encourages formation of cracks at defined positions (14) within the passivation layer when mechanical stresses arise within the layer.
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