POSITIONING JIG, POSITIONING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND SOLDERING APPARATUS

摘要

PPROBLEM TO BE SOLVED: To make it possible to solder a semiconductor device well to a junction, and at the same time, to form a good solder filet. PSOLUTION: A positioning jig IK is equipped with a first jig 32 and a second jig 35. The first jig 32 has a positioning hole 34 which can insert a semiconductor sheet 33 and a semiconductor device 12, and the positioning hole 34 is arranged at a circuit board 11 so as to correspond to a metal circuit 13. The second jig 35 is possible to be inserted into and removed from the positioning hole 34, and at the same time, while being inserted into the positioning hole 34, it is equipped with a pressurization plane 35a which is arranged so as to face the metal circuit 13 and pressurizes the semiconductor device 12 on the semiconductor sheet 33 to the circuit board 11 side. The second positioning jig 35 is positioned by the wall 34a of the positioning hole 34 so that the pressurization plane 35a is arranged at the position to face the metal circuit 13 when the second jig 35 is inserted into the positioning hole 34. PCOPYRIGHT: (C)2007,JPO&INPIT