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The device and the method where it accumulates and levels the thin film of the semiconductor wafer and
The device and the method where it accumulates and levels the thin film of the semiconductor wafer and
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机译:积聚和校平半导体晶片的薄膜的装置和方法
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摘要
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
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