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Semiconductor wafer, semiconductor thin film, and method for manufacturing semiconductor thin film devices
Semiconductor wafer, semiconductor thin film, and method for manufacturing semiconductor thin film devices
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机译:半导体晶片,半导体薄膜及其制造方法
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摘要
A method for manufacturing a semiconductor thin film device includes: forming a buffer layer on an Si (111) substrate and a single crystal semiconductor layer on the buffer layer; forming an island including the semiconductor layer, buffer layer, and a portion of the substrate; forming a coating layer on the island; etching the substrate along its Si (111) plane to release the island from the substrate, the coating layer serving as a mask; and bonding the released island to another substrate, a released surface of the released island contacting the another substrate. A semiconductor device includes a single crystal semiconductor layer other than Si, which has a semiconductor device formed on a front surface of an Si (111) layer lying in a (111) plane. The layer is bonded to another substrate with a back surface contacting the another substrate or a bonding layer formed on the another substrate.
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