首页>
外国专利>
DEVICE AND METHOD FOR MEASURING FILM THICKNESS OF SEMICONDUCTOR THIN FILM, SEMICONDUCTOR WAFER, AND ITS MANUFACTURING METHOD
DEVICE AND METHOD FOR MEASURING FILM THICKNESS OF SEMICONDUCTOR THIN FILM, SEMICONDUCTOR WAFER, AND ITS MANUFACTURING METHOD
展开▼
机译:用于测量半导体薄膜,半导体晶片的膜厚度的装置和方法及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To easily discriminate a peak for indicating the interface of a semiconductor thin film such as an epitaxial layer by correcting the position of a zero point so that the zero point of a reflection factor crosses the wave of the lowest frequency component of a reflection spectrum that is obtained by performing the Fourier transform of detection data and is located in a straight line in parallel with an abscissa. ;SOLUTION: Luminous flux entering a Michelson interferometer 8 through an aspherical mirror 7 after being emitted from a light source 6 is divided by a beam splitter 9, is reflected by a fixed mirror 10 and a traveling mirror 11, and then is synthesized for interference. Interference light with a different wavenumber is applied to a sample 13 by a mirror 12, the reflection light is detected by a detector 14, and spatial interference intensity waveform can be obtained. The obtained spatial interference intensity waveform is subjected to Fourier transform to obtain a reflection spectrum, and at the same time the zero-point position of the ordinate (reflection factor) of the reflection spectrum is corrected by a zero-point correction means. Further, by performing inverse Fourier transform using the inverse Fourier transform means, a spatial interference intensity waveform where noise has been eliminated can be obtained.;COPYRIGHT: (C)2000,JPO
展开▼