COPPER FOIL WITH ADHESION ASSISTANT, PRINTED WIRING BOARD AND VALUATION METHOD FOR CURING DEGREE

摘要

PROBLEM TO BE SOLVED: To provide copper foil with an adhesion assistant having little variation in adhesive force by suppressing a variation in adhesion strength between the copper foil and an insulating resin layer, a printed wiring board excellent in reliability using it, and a valuation method for a curing degree of the adhesion assistant.;SOLUTION: The copper foil with the adhesion assistant is made by applying the resin varnish containing epoxy resin to the copper foil, heated and dried. The thickness of the adhesion assistant layer is 1 μm or more and 5 μm or less, and the curing degree of the adhesion assistant is 0.3 or more and 0.6 or less.;COPYRIGHT: (C)2007,JPO&INPIT