首页> 外国专利> COMPOSITE DIELECTRIC MATERIAL, PREPREG USING THE SAME, METAL FOIL PAINTED OBJECT, MOLDED COMPACT, COMPOSITE DIELECTRIC BASE BOARD, MULTI-LAYERED BASE BOARD, AND MANUFACTURING METHOD OF COMPOSITE DIELECTRIC MATERIAL

COMPOSITE DIELECTRIC MATERIAL, PREPREG USING THE SAME, METAL FOIL PAINTED OBJECT, MOLDED COMPACT, COMPOSITE DIELECTRIC BASE BOARD, MULTI-LAYERED BASE BOARD, AND MANUFACTURING METHOD OF COMPOSITE DIELECTRIC MATERIAL

机译:复合介电材料,使用相同的材​​料预涂,金属箔涂漆的物体,模压复合材料,复合介电基板,多层基板以及复合介电材料的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a composite dielectric material realizing high relative dielectric constant r, having high Q-value, having the relative dielectric constant with small temperature changing rate.;SOLUTION: The composite dielectric material contains dielectric ceramics and organic polymeric material. The dielectric ceramics contains powder of oxide having a composition expressed by general formula: (M, Li, Bi, RE)xTiO3, (wherein, M denotes at least one kind selected from Ba, Sr, and Ca; RE denotes at least one kind selected from La, Ce, Pr, Nd, Sm, Y, Yb, and Dy; and 0.9x1.05).;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种实现高相对介电常数r,Q值高,相对介电常数且温度变化率小的复合介电材料。解决方案:复合介电材料包含介电陶瓷和有机高分子材料。介电陶瓷包含具有以下通式组成的氧化物粉末:(M,Li,Bi,RE) x TiO 3 ,其中,M表示至少一种选自Ba,Sr和Ca中的一种; RE表示选自La,Ce,Pr,Nd,Sm,Y,Yb和Dy中的至少一种;以及0.9x1.05)。版权所有:(C)2007,日本特许厅

著录项

  • 公开/公告号JP2006344407A

    专利类型

  • 公开/公告日2006-12-21

    原文格式PDF

  • 申请/专利权人 TDK CORP;

    申请/专利号JP20050166920

  • 申请日2005-06-07

  • 分类号H01B3/12;H05K1/03;H01B5/14;C01G23;B32B17/04;H05K3/46;C08L101;C08K3/22;C08J5/10;

  • 国家 JP

  • 入库时间 2022-08-21 21:10:27

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